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Circuit Products Product List and Ranking from 9 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Circuit Products Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 三共化成 Tokyo//Manufacturing and processing contract
  2. 大英エレクトロニクス Tokyo//Electronic Components and Semiconductors
  3. 星光社 営業本部 Tokyo//IT/Telecommunications
  4. 4 大同特殊鋼 電子部材製品部　軟磁性チ－ム Aichi//Ferrous/Non-ferrous metals
  5. 4 日精 本社 Tokyo//Machine elements and parts
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Circuit Products Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. MID (Molded Interconnect Devices) 三共化成
  2. What is the technology 'MID' that replaces PCB and FPC for miniaturization of resin molded products? 大英エレクトロニクス
  3. Terminal Circuit Unit [RP-1120] 星光社 営業本部
  4. STARPAS(R) Proposal Materials 大同特殊鋼 電子部材製品部　軟磁性チ－ム
  5. 4 MID (Molded Interconnect Device) 日精 本社

Circuit Products Product List

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MID (Molded Interconnect Devices)

MID (Molded Interconnect Devices)

Creation of new devices using the 3D-MID laser process.

Sankyo Kasei Co., Ltd. provides a wide range of solutions from the development and prototyping of 3D-MID components to mass production, based on the technology and know-how accumulated over more than 30 years of MID production experience. [Features] ■ Circuit patterns can be formed on three-dimensional structures (molded products) regardless of the outer circumference, upper surface, or inner surface. ■ MID components that can be implemented with solder reflow are available. ■ Compatible with devices that have chip mounting and wire bonding.

  • Contract manufacturing
  • Other machine elements

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Bias T RF + DC Circuit [High Frequency / Microwave / RF]

Bias T RF + DC Circuit [High Frequency / Microwave / RF]

You can use RF (high frequency) components and DC (direct current) components for mixing and separation. Domestic processing is available, even for small quantities!

It is used to mix and separate RF (high frequency) components and DC (direct current) components. The RF port is impedance matched to 50Ω, and we offer products that can be used for DC component biasing, removal, and as surge protectors. We develop products according to our customers' applications and requirements. *For more details, please download the PDF or feel free to contact us.

  • Other Connectors

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Terminal Circuit Unit [RP-1120]

Terminal Circuit Unit [RP-1120]

This is a terminal circuit unit that accommodates multiple terminal circuits for use in two-wire or four-wire line relay of the delivery terminal telephone channel.

■□■Features■□■ ■It can be used with various types of transmission terminals such as short-distance transmission, optical transmission, and cable PCM. ■Connection with the transmission terminal is made via 4W, SS(DL)/SR(RG) terminals. ■It has a plug-in type circuit board that can be detached for each line, making maintenance easy.

  • Printed Circuit Board
  • PBX/IP phone
  • Other network tools

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MID (Molded Interconnect Device)

MID (Molded Interconnect Device)

Forming patterns on complex 3D shapes - Molded circuit components "MID" [Contributes to "miniaturization," "lightweight," and "thinness."]

MID (Molded Interconnect Device) refers to plastic injection molded products with electrical circuit wiring that possess both mechanical and electrical functions. Its features include simplification of wiring between electrical components, miniaturization of devices through space-saving wiring arrangements, and increased design flexibility through direct implementation onto three-dimensional molded parts. It is increasingly adopted in wearable devices, automobiles, and small medical devices. We offer proposals for miniaturizing and thinning electronic devices, handling everything from molding to pattern design. **Advantages of MID:** - **Lightweight:** Directly drawing patterns onto plastic molded products eliminates the need for separate circuit boards and their screws, leading to weight reduction. - **Compactness:** It can be implemented in three dimensions, contributing to the miniaturization of components in a space-saving manner. - **Simplified Assembly:** Reducing the assembly labor for circuit module boards leads to higher precision. *For more details, please contact us.*

  • Plating Equipment

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Cost Response Case: "Electronic Circuit Components"

Cost Response Case: "Electronic Circuit Components"

Introducing a case study on new parts production. Successfully balancing quality and cost.

We would like to introduce a cost response case related to our electronic circuit components. We received a request from a powertrain system manufacturer for new electronic circuit components to be incorporated into their powertrain. It was essential to establish a production system that posed no quality issues, and they also desired a cost advantage. In response, we addressed this by sourcing overseas in Leading Competitive Countries (LCC). We established a Chinese subsidiary, "Chuanggai Electronic Trading (Shanghai) Co., Ltd.," and implemented production in China under our management to achieve both quality and cost balance. As a result, we were pleased to achieve the target price. [Case Study] ■ Concerns - New electronic circuit components to be incorporated into the powertrain - It is essential to establish a production system that poses no quality issues - Desire for a cost advantage ■ Response - Overseas sourcing in LCC - Established the Chinese subsidiary "Chuanggai Electronic Trading (Shanghai) Co., Ltd." - Implemented production in China under management to achieve both quality and cost balance *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Other contract services

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STARPAS(R) Proposal Materials

STARPAS(R) Proposal Materials

It can also be used for the configuration of magnetic circuits within substrates and interposers! We propose various examples of utilization.

This document introduces various applications of 'STARPAS(R)' handled by Daido Special Steel Co., Ltd. It includes noise countermeasures for mobile devices (smartphones, IoT devices) and motor devices (industrial and automotive), as well as various other applications. We also propose possibilities for new applications that leverage processability and thin materials. Please take a moment to read it. [Contents] ■ The necessity of noise countermeasures using STARPAS(R) for mobile devices (smartphones, IoT devices) ■ The necessity of noise countermeasures using STARPAS(R) for motor devices (industrial and automotive) ■ Proposal of STARPAS(R) for shielding semiconductor devices ■ Magnetic field shielding properties using the KEC method (for high sensitivity) ■ Proposal of possibilities for new applications leveraging processability and thin materials (Just Idea) *For more details, please refer to the PDF document or feel free to contact us.

  • others

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Thin-film integrated circuit components

Thin-film integrated circuit components

Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

  • Other electronic parts

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What is the technology 'MID' that replaces PCB and FPC for miniaturization of resin molded products?

What is the technology 'MID' that replaces PCB and FPC for miniaturization of resin molded products?

MID enables wiring formation that does not rely on circuit boards or harnesses, contributing to thinner, smaller, and lighter designs through the reduction of component count.

3D-MID refers to molded circuit components that directly incorporate wiring into plastic injection molded products. By three-dimensional wiring of the housing as part of the printed circuit board, it enables the miniaturization, thinness, lightweight, and enhancement of product functionality. Currently, there are mainly two types of methods for 3D-MID: the two-shot molding method and the laser method. Within these two types, there are several additional techniques. 【Features of MID】 - Direct wiring and component mounting on the housing enable miniaturization, thinness, and lightweight design. - Reduction in the number of components (material savings). - Reduction in assembly labor. - Cost reduction due to the decrease in the number of components and assembly labor. - By combining printed circuit boards with 3D-MID, it addresses the high-density products that cannot be managed by printed circuit boards alone. *For more details, please refer to the related links or feel free to contact us.

  • Other CAD
  • Other contract services

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Kaneno Precision Industries, Inc.

Kaneno Precision Industries, Inc.

We produce hydraulic precision parts and various yoke components in a seamless process centered around two lines of NC machines and general-purpose machines.

Kaneno Precision Industry Co., Ltd. specializes in hydraulic cases, hydraulic circuit components, yokes, end hooks, lever joints, and other main products. We excel in processing hydraulic circuit components and hydraulic cases that require cleanliness, primarily using machining centers, as well as processing angle steel using general-purpose and dedicated machines. In particular, we can accommodate yoke-related components of all types, from one-off items to mass production.

  • others

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