We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Circuit Products.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Circuit Products Product List and Ranking from 10 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

Circuit Products Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. 大英エレクトロニクス Tokyo//Electronic Components and Semiconductors
  2. IAM Electronics Co., Ltd. Nagano//Industrial Electrical Equipment
  3. Sanyo Kasei Co., Ltd. Tokyo//Manufacturing and processing contract
  4. JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office Tokyo//Ceramics
  5. 5 星光社 営業本部 Tokyo//IT/Telecommunications
Go to Company Ranking

Circuit Products Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. What is the technology 'MID' that replaces PCB and FPC for miniaturization of resin molded products? 大英エレクトロニクス
  2. CR Network IAM Electronics Co., Ltd.
  3. MID (Molded Interconnect Devices) Sanyo Kasei Co., Ltd.
  4. Thin-film integrated circuit components JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  5. 5 Terminal Circuit Unit [RP-1120] 星光社 営業本部

Circuit Products Product List

1～10 item / All 10 items

Displayed results
CR Network

CR Network

Ideal for applications such as microcontroller control circuits and operational amplifier control circuits!

The "CR Network" enables the formation of a highly reliable circuit network due to the reduction in the number of components in the implementation, which not only lowers management and assembly costs. It is suitable for applications such as digital interface circuits, microcontroller control circuits, and display control circuits. 【Features】 ■ Reduction in the number of components in the implementation ■ Formation of a highly reliable circuit network ■ Well-suited for digital interface circuits, etc. ■ EU RoHS compliant *For more details, please refer to the PDF document or feel free to contact us.

  • image1.png
  • image2.png
  • image3.png
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
MID (Molded Interconnect Devices)

MID (Molded Interconnect Devices)

Creation of new devices using the 3D-MID laser process.

Sankyo Kasei Co., Ltd. provides a wide range of solutions from the development and prototyping of 3D-MID components to mass production, based on the technology and know-how accumulated over more than 30 years of MID production experience. [Features] ■ Circuit patterns can be formed on three-dimensional structures (molded products) regardless of the outer circumference, upper surface, or inner surface. ■ MID components that can be implemented with solder reflow are available. ■ Compatible with devices that have chip mounting and wire bonding.

  • Contract manufacturing
  • Other machine elements

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Bias T RF + DC Circuit [High Frequency / Microwave / RF]

Bias T RF + DC Circuit [High Frequency / Microwave / RF]

You can use RF (high frequency) components and DC (direct current) components for mixing and separation. Domestic processing is available, even for small quantities!

It is used to mix and separate RF (high frequency) components and DC (direct current) components. The RF port is impedance matched to 50Ω, and we offer products that can be used for DC component biasing, removal, and as surge protectors. We develop products according to our customers' applications and requirements. *For more details, please download the PDF or feel free to contact us.

  • Other Connectors

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Terminal Circuit Unit [RP-1120]

Terminal Circuit Unit [RP-1120]

This is a terminal circuit unit that accommodates multiple terminal circuits for use in two-wire or four-wire line relay of the delivery terminal telephone channel.

■□■Features■□■ ■It can be used with various types of transmission terminals such as short-distance transmission, optical transmission, and cable PCM. ■Connection with the transmission terminal is made via 4W, SS(DL)/SR(RG) terminals. ■It has a plug-in type circuit board that can be detached for each line, making maintenance easy.

  • Printed Circuit Board
  • PBX/IP phone
  • Other network tools

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
MID (Molded Interconnect Device)

MID (Molded Interconnect Device)

Forming patterns on complex 3D shapes - Molded circuit components "MID" [Contributes to "miniaturization," "lightweight," and "thinness."]

MID (Molded Interconnect Device) refers to plastic injection molded products with electrical circuit wiring that possess both mechanical and electrical functions. Its features include simplification of wiring between electrical components, miniaturization of devices through space-saving wiring arrangements, and increased design flexibility through direct implementation onto three-dimensional molded parts. It is increasingly adopted in wearable devices, automobiles, and small medical devices. We offer proposals for miniaturizing and thinning electronic devices, handling everything from molding to pattern design. **Advantages of MID:** - **Lightweight:** Directly drawing patterns onto plastic molded products eliminates the need for separate circuit boards and their screws, leading to weight reduction. - **Compactness:** It can be implemented in three dimensions, contributing to the miniaturization of components in a space-saving manner. - **Simplified Assembly:** Reducing the assembly labor for circuit module boards leads to higher precision. *For more details, please contact us.*

  • Plating Equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Cost Response Case: "Electronic Circuit Components"

Cost Response Case: "Electronic Circuit Components"

Introducing a case study on new parts production. Successfully balancing quality and cost.

We would like to introduce a cost response case related to our electronic circuit components. We received a request from a powertrain system manufacturer for new electronic circuit components to be incorporated into their powertrain. It was essential to establish a production system that posed no quality issues, and they also desired a cost advantage. In response, we addressed this by sourcing overseas in Leading Competitive Countries (LCC). We established a Chinese subsidiary, "Chuanggai Electronic Trading (Shanghai) Co., Ltd.," and implemented production in China under our management to achieve both quality and cost balance. As a result, we were pleased to achieve the target price. [Case Study] ■ Concerns - New electronic circuit components to be incorporated into the powertrain - It is essential to establish a production system that poses no quality issues - Desire for a cost advantage ■ Response - Overseas sourcing in LCC - Established the Chinese subsidiary "Chuanggai Electronic Trading (Shanghai) Co., Ltd." - Implemented production in China under management to achieve both quality and cost balance *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Other contract services

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
STARPAS(R) Proposal Materials

STARPAS(R) Proposal Materials

It can also be used for the configuration of magnetic circuits within substrates and interposers! We propose various examples of utilization.

This document introduces various applications of 'STARPAS(R)' handled by Daido Special Steel Co., Ltd. It includes noise countermeasures for mobile devices (smartphones, IoT devices) and motor devices (industrial and automotive), as well as various other applications. We also propose possibilities for new applications that leverage processability and thin materials. Please take a moment to read it. [Contents] ■ The necessity of noise countermeasures using STARPAS(R) for mobile devices (smartphones, IoT devices) ■ The necessity of noise countermeasures using STARPAS(R) for motor devices (industrial and automotive) ■ Proposal of STARPAS(R) for shielding semiconductor devices ■ Magnetic field shielding properties using the KEC method (for high sensitivity) ■ Proposal of possibilities for new applications leveraging processability and thin materials (Just Idea) *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Thin-film integrated circuit components

Thin-film integrated circuit components

Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
What is the technology 'MID' that replaces PCB and FPC for miniaturization of resin molded products?

What is the technology 'MID' that replaces PCB and FPC for miniaturization of resin molded products?

MID enables wiring formation that does not rely on circuit boards or harnesses, contributing to thinner, smaller, and lighter designs through the reduction of component count.

3D-MID refers to molded circuit components that directly incorporate wiring into plastic injection molded products. By three-dimensional wiring of the housing as part of the printed circuit board, it enables the miniaturization, thinness, lightweight, and enhancement of product functionality. Currently, there are mainly two types of methods for 3D-MID: the two-shot molding method and the laser method. Within these two types, there are several additional techniques. 【Features of MID】 - Direct wiring and component mounting on the housing enable miniaturization, thinness, and lightweight design. - Reduction in the number of components (material savings). - Reduction in assembly labor. - Cost reduction due to the decrease in the number of components and assembly labor. - By combining printed circuit boards with 3D-MID, it addresses the high-density products that cannot be managed by printed circuit boards alone. *For more details, please refer to the related links or feel free to contact us.

  • Other CAD
  • Other contract services

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Kaneno Precision Industries, Inc.

Kaneno Precision Industries, Inc.

We produce hydraulic precision parts and various yoke components in a seamless process centered around two lines of NC machines and general-purpose machines.

Kaneno Precision Industry Co., Ltd. specializes in hydraulic cases, hydraulic circuit components, yokes, end hooks, lever joints, and other main products. We excel in processing hydraulic circuit components and hydraulic cases that require cleanliness, primarily using machining centers, as well as processing angle steel using general-purpose and dedicated machines. In particular, we can accommodate yoke-related components of all types, from one-off items to mass production.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.